PI film and silicone adhesive are applied to provide a tape with stable properties in processes requiring high heat resistance

Application

• Soldering Rigid PCB
• Soldering Flexible PCB

Structure

Feature

• Excellent heat resistance
• Excellent chemical resistance
• No residue after peel

Products

Prevents contamination and scratches during the semiconductor manufacturing process, and there is no soft peeling and adhesive residue to prevent contamination and scratches on the product.

Application

• Protect Semiconductor Production Process

Structure

Feature

• Application of transparent film provides visibility
• Soft peel
• Constant adhesive
• No residue after peel

Tape used to fix the work in the dicing process during the manufacturing process of semiconductors, electronic components, and optical components. This tape prevents chipping and chip flying problems during a dicing process with a strong adhesive force and may be easily peeled off without contamination or damage during die pick-up due to degradation of adhesive force after UV irradiation.

Application

• Semiconductor Chip Dicing Process

Structure

Feature

• Reduce the chipping chip flying distance
• Excellent stability over time
• Excellent adhesion
• No residue after UV light irradiation